Co-sputtering system for the deposition of functional layers
for sensor applications, micro- and optoelectronics
System description
The FHR.Star.150-Co is a specially designed highly compact cluster tool for processing of 200 mm (8 inches)
diameter wafer-like substrates or smaller substrates placed on a carrier of same size. The setup consists
of a carrier-magazine load lock, a handler chamber and two process chambers. Each process chamber can
hold up to three sputter sources, all arranged in confocal geometry. The sputter sources are equipped with
planar cathodes of 150 mm diameter and pneumatically controlled shutters, allowing both sequential and
co-deposition. All sources can be shifted in-situ along their axial direction and additionally ex-situ in lateral
direction. As a consequence, substrates of different heights can be coated at variable target-substrate
distances without having to break the vacuum. One process chamber is laid out for high temperature
process, i.e. the substrate holder can be heated up to 400 °C. The second process chamber is designed for low
temperature processes, i.e. the substrate holder is cooled down by a combination of liquid H2O and Ar gas
cooling. Substrates and carriers are automatically transported from and to process chambers by a handler
with lift up/down from a magazine cassette lifting system. A sequential treatment of substrates can be
carried out automatically according to the programmed process flow
Process
- High-temperature chamber: reactive magnetron sputtering (1 x DC, 1 x RF, 1 x DC optional)
- Low-temperature chamber: reactive magnetron sputtering (1 x DC, 1 x RF, 1 x DC optional)
- Deposition onto a rotating substrate holder (1 x cooled, 1 x heated), DC bias can be applied
Benefits for the customer
- Effective utilization of floor space by maximum spatial compactness
- Adjustable substrate-target distance by in-situ axial and ex-situ lateral displacement of sputter sources
- Fully automatic process control
- Quick and easy system maintenance
Key figures
Special features
- Rotating substrate holder
- Adjustable distance between substrate and target
- Fully automated process control
- CE label
- Made in Germany
Options
- Pretreatment by inverse sputter etching
- MF sputtering (unipolar pulsed)
- Multiple RF sputtering (including subsequent
upgrade of DC sources by matchbox installation) - Customized magazine load lock system
Typical applications
- Multilayered films for MEMS and sensor
applications - Functional films for micro- and
optoelectronics
