Single-chamber magnetron sputter system for small batch
production of optics, MEMS & sensors
System description
Single-chamber sputtering systems of our FHR.Boxx product series – alternatively called boxcoaters – provide
a cost-attractive solution for the task of depositing numerous substrates in small batch productions.
The setup is usually not equipped with an additional load lock chamber. Instead, the substrates are manually
placed onto a rotating drum inside the process chamber. Optionally,
also two drums can employed for ambient assembly/disassembly,
and the drums can also be used for substrate heating.
By starting the rotation of the drum, the substrates are driven past
different sputtering sections, allowing sequential deposition from
multiple sources and/or pre-treatment by means of plasma etching.
Overall, a fine homogeneity of layer thicknesses can be achieved,
and by optional subrotation also substrates with more complex
geometries can be deposited with a high thickness uniformity.
Process
- Magnetron sputtering (DC or RF mode)
- Pre-treatment (e.g. plasma etching)
Benefits for the customer
- Compact design
- Easy to service, very good accessibility of all components
- Clean room compatible with clean room wall
- Attractive investment and running costs
Key figures
Special features
- PLC-controlled process
- CE label
- Made in Germany
Options
- Reactive sputtering on request
- Load lock chamber
Typical applications
- Functional coatings for MEMS & sensors
- Optical coatings on illuminants
- Decorative coatings
- Sputtering of layer stacks
