- High-end flex, rigid-flex, and rigid MLBs
- Rigid PCBs with 1-20 layers
- Impedance-controlled PCBs +/- 5%
- Panel and reel-to-reel production lines
- HDIs: laser and mechanical drilling
- Laser openings (cavities) + depth controlled routing
- Final finishing: ENIG, ENEPIG, Imm. Sn, Imm. Ag,
- ISIG, EPIG, OSP, electroplated Au
- Copper filled blind vias, copper filled through holes
- Lines/spaces down to 25/25 μm (1 mil)
- Microvias down to 30 μm (1.2 mil)
- Non conductive epoxy via plugging
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