Board assembly and packaging Die attach, COB, flip chip, bare die, MMICs, SMD (min. 01005), µBGA Wire/ribbon bonding Automatic ball-wedge and wedge-wedge wire bonding Soldering Packaging, glob top MEMS / RF MEMS packaging Hermetic housing (metal, ceramic) Tags: 生醫, PCB, 網通 Board assembly and packaging / Cicor Continue Reading Previous PostThin-and thick-film technologyNext PostElectronic Solutions You Might Also Like Aerospace and defence 2018-01-15 Medical 2018-01-14 Thin-and thick-film technology 2018-01-15
