Combining PCB production processes

®DenciTec

Combining PCB production processes

Swiss engineered technology

• Miniaturization  
  Lines/spaces down to 25/25 μm (1 mil) with  
  20 µm Cu thickness  
  Significantly higher level of integration  
  For example: more volume for energy supply,  batteries, etc.  
• Higher packaging densities  
  More design options  
• More functionality  
  Smarter products with more features  
• Lower costs compared to other technologies  
  Economic