General Description
HEATFLOW-SIL® is a thermally interface material that have high thermally conductivity , electrical 
insulation , and flame retardancy.
HEATFLOW-SIL® SOFT types are highly conformable, self tacky , and high thermally conductive silicone gap pad. HEATFLOW-SIL® HARD type are high hardness, electrical insulation, and thermal conductive silicone sheet.? The combination of a carrier material such as fiberglass and silicone resin which is conformable provides the engineer with a more versatile material than mica or grease. ?The HEATFLOW-SIL® designs below are detailed in their thermally conductivity and performance characteristics. Follow the general guidelines to determine the design characteristics most suitable for your application.
HEATFLOW-SIL®SOFT TYPE
L2Y Thermal Interface Material HEATFLOW-SIL® SOFT TYPE (TCS series) is an advanced thermally conductive silicone rubber with superior flame retardant. The HEATFLOW-SIL® SOFT type family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surfaces are present.
Special feature
- Soft and flexible elastic silicone conformable pads
- Any thickness are available
- Excellent heat conductivity
- Excellent flame retardant as UL94V-O level
- Easy for cutting and mounting
- Excellent electrical insulation properties
Application
- Areas where heat needs to be transferred away to the frame chassis or other type of heat spreader
- Between a CPU and a heat spreader
- Between a CD ROM and a heat spreader
- Between a semiconductor and heat sink
- Replacement for messy grease
Products supply
- HEATFLOW-SIL® SOFT TYPE is available in standard size and custom widths and length
- Thickness (mm) : 0.5, 1.0, 2.0, 3.0, 4.0 ···
- Standard Size (mm) : 200 ◆ 200, 300 ◆ 300
- Available Configurations : Rolls (Only under 2 mm), Sheets, Die-cuts
- Easy for cutting and mounting
- Excellent electrical insulation properties
