Co-sputtering system for the deposition of functional layers
for sensor applications, micro- and optoelectronics
System description
The FHR.Star.100-TetraCo is a specially designed, highly compact sputtering tool for processing of wafer-like substrates or substrate carriers. The setup consists of a carrier-magazine load lock, a handling chamber and a process chamber with three sputtering sources and a pre-cleaning etcher, all arranged in confocal geometry. Deposition is carried out onto an unheated rotating backing plate holding the substrate carrier.
The sputtering sources are equipped with planar cathodes of 100 mm diameter and pneumatically controlled shutters, allowing both sequential and co-deposition. Additionally, each source can be shifted along its axial direction and allows a lateral shift. As a consequence, substrates of different heights can be coated at variable target-substrate distances. The substrate carrier is transported by handler with lift up/down from magazine cassette lifting system. The sequential treatment of the substrates is done automatically according to the programmed process flow.
Process
- Reactive and non-reactive magnetron sputterin(DC mode)
- Pre-treatment (e.g. plasma etching)
- Co-deposition onto a rotating substrate holder
Benefits for the customer
- Compact design with low footprint
- Possibility for cleanroom wall mounting
- Quick and easy system maintenance
- Attractive investment and running costs
Key figures
Special features
- Rotating substrate holder
- Adjustable distance between substrate and target
- Fully automated process control
- CE label
- Made in Germany
Options
- MF sputtering
- RF sputtering
- Heated substrate holder (T < 500 °C)
- Standard wafer cassette
- Customized magazine load lock system
Typical applications
- Multilayered films for MEMS and sensor applications
- Functional coatings for micro- and optoelectronics
