SEMI Standard-compatible thin film process platform for
industrial manufacturing of microelectronics and optics
System description
The FHR.Star.300 is a cluster type system for processing of wafers up to 200 mm (8 inches) diameter. The
setup consists of connected vacuum chambers. The center is formed by a transfer chamber with a heavy duty
vacuum handler, which can be connected to a maximum of eight modules by rectangular ports.
In the pictured configuration two ports are equipped with load lock chambers holding magazines with
substrate carriers. Four additional ports are equipped with one plasma pre-etching module and three sputter
modules with DC, pulsed DC and DC reactive processes from planar cathodes with 300 mm target diameter.
Substrate loading is performed by the handling system. According to the programmed process flow, the
sequential treatment of the substrates in the individual modules is carried out automatically
Typical applications
- SiC power devices
- Sensors
- MEMS
- Optoelectronics
- High-end optical films
Benefits for the customer
- Industrial production tool compatible with SEMI Standards
- Fully automated process control
- Quick and easy target replacement
Key figures
Special features
- Clean room compatible with clean room wall
- Handling of heavy substrates (up to 15 kg)
- Temperature control of substrate and carrier
- Tailored configuration according to customer‘s needs
- CE label
- Made in Germany
Available process modules
- Magnetron sputtering (DC or RF mode)
- Plasma etching (PE) or reactive ion etching (RIE)
- Thermal or electron beam evaporation
- Plasma-enhanced chemical vapor deposition (PECVD)
- Atomic layer deposition (ALD)
- Flash lamp annealing (FLA)
