Compact inline coating system with carrier turning unit for double-sided deposition
System description
The FHR.Line.600.V is a vertical inline deposition system for the coating of flat substrates up to a size of 500 x 500 x 12 mm3 . It is designed as a single-ended system possessing a load lock module and a process module which is detached by a flap valve and equipped with two door flanges. The first door flange contains an inverted sputter etcher for substrate pre-cleaning. The second door flange can be fitted with up to two 600 mm long rotatable cathodes for DC/MF-sputtering. The load lock chamber is designed to allow a fullyautomatic 180° rotation of the carrier around its vertical axis, which enables a double-sided coating of the substrates without breaking the vacuum. Additionally, the carrier can oscillate in front of the technological units, allowing the deposition of multiple layer systems. The carrier transport is done fully automatic by a series of rollers coupled by a toothed belt, which can be electrically insulated on request, in order to allow the application of a DC bias voltage. Standard carriers are designed for the transport of one single substrate of dimensions 500 x 500 x 1 mm3 or 36 substrates of dimensions 50 x 50 x 1 mm3 , other carrier versions are available on request.
Process
- Reactive and non-reactive magnetron sputter deposition (standard DC, MF pulsed or RF on request)
- Substrate pre-cleaning (e.g. inversed sputter etching
Benefits for the customer
- Compact design with minimzed footprint
- Fully automated process control
- Economical alternative for double-sided deposition
- Attractive investment and running costs
Key figures
Special features
- CE label
- Made in Germany
Options
- Integration of additional process modules
- Second load lock module for a double-ended coating system
Typical applications
- Functional coatings for MEMS and sensors
- Multilayered films for micro- and optoelectronics
- Decorative coatings
